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Scientific Topics
Silicon material and defect engineering
Wafering technologies and direct-wafer production
Junction formation
Cleaning, etching, layer deposition technologies, surface morphology and surface passivation
Carrier selective contacts, metallization and contact formation
Advanced light management
Advanced characterization and simulation
High-capacitance cell and module performance testing
Process integration and low-cost manufacturing
New manufacturing tools
Si-based tandem cells, new materials and novel approaches
Module processing and materials
Module reliability and production yield
High and record efficiency devices
Review papers
nPV on Wednesday
会议交流主题
硅材料及其缺陷工程
晶圆及直接键合技术
半导体结制造
硅片清洗、刻蚀及沉积技术和表面形貌及其钝化
载流子选择性接触和金属化及其接触
先进光学系统
先进表征及模拟技术
高容量电池及其性能测试
工艺集成和低成本制造
新型制造方法
硅基串联电池和新型材料及制造手段
组件处理及其材料
组件可靠性及其产量
高效率设备
论文审核
周三的N型电池研讨会 (nPV)
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